| 1. | Solderability tests for surface mounted devices
表面组装元器件可焊性试验 |
| 2. | Smd : surface mount device
表面安装设备 |
| 3. | Preconditioning of nonhermetic surface mount devices prior to reliability testing
可靠性试验之前不密闭表面安装设备的预调节 |
| 4. | Handling , packing , shipping and use of moisture reflow sensitive surface mount devices
对潮气回流敏感的表面安装器械的搬运包装运输和使用 |
| 5. | Smd . surface mounting technology - transportation and storage conditions of surface mounting devices - application guide
地面安装工艺.地面安装设备 |
| 6. | Semiconductor discrete device dimensions of outline and lead - frame for the surface mounting device
半导体分立器件表面安装器件外形尺寸及其引线框架尺寸 |
| 7. | Standard for handling , packing , shipping and use of moisture reflow sensitive surface mount devices
表面安装的湿度反流敏感设备的搬运包装船运和使用标准 |
| 8. | Printed wiring boards - guide for the design and use of printed wiring boards : surface mounted devices
印制电路板.第23部分:设计和使用导则:表面安装器件规范 |
| 9. | Smd . surface mounting technology - part 2 : transportation and storage conditions of surface mounting devices - application guide
表面安装技术.第2部分:表面安装装置 |
| 10. | Smd . en 61760 - 2 surface mounting technology . part 2 : transportation and storage conditions of surface mounting devices . application guide
表面安装技术.第2部分:表面安装装置 |
